PIKA TECHNOLOGIES INC.
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Development Highlights

We worked long and hard on the initial design of the Warp hardware platform to insure reliability, longevity and quality.
Here are a few of the procedures and tests that we completed during the design process:

  • We selected telephone interface chips that have a proven history of reliable operation in the field.
  • The processor core was based on an established reference design from AMCC
  • We paid close attention to maintaining good signal integrity of all electrical signals to maximize noise immunity and prevent errors.
  • We designed the digital circuits for worst case timing.
  • We derated components for power and voltage ratings to ensure they would not be highly stressed so they would last longer.
  • We included ESD protection devices on inputs to help protect the system from damage.
  • We designed the plastic enclosure for the wide range of thermal loads expected and included a fan to ensure that thermal stress would be limited.
  • We designed the telephony interfaces for, and verified that they met, regulatory interconnect requirements for US, Canada and Europe including lightning surge tests and ESD.
  • We designed the product for, and verified that it would meet, regulatory safety requirements for US, Canada and Europe including drop test, impact test and power line cross test.,
  • We conducted long duration stress testing of hardware and diagnostic testing of software to ensure that operation would be stable over long periods of time.
  • We verified that the product would operate correctly over stated, wide operating temperature range by running long duration diagnostic software stress tests at various operating temperatures.
 
 
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